The 17th IEEE International Conference on IC Design and Technology

General Information

The 17th IEEE International Conference on IC Design and Technology (ICICDT) is the global forum for interaction and collaboration of IC design and technology for "accelerating product time-to-market". Close collaboration of the multi-discipline technical fields design/device/process accelerates the implementation of new designs and new technologies into manufacturing.


ICICDT 2019 will be held in the historical garden city of China --- Suzhou during June 17th to June 19th, 2019.

ICICDT 2019 将于2019年6月17日-19日在历史文化名城及国家花园城市中国苏州举办。

The ICICDT 2019 Call for Papers is available for download.

ICICDT 2019 征文通知可供下载。

Design and technology co-optimization provide key advantage in the highly competitive market today. However, integrated circuit (IC) engineering traditionally separates design and technology and the two don’t use the same language, let alone understand each other. This is not a winning approach moving forward. Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one to one basis during the poster session.


Contributed papers are solicited but not limited in the following subject areas:


  • Advanced materials and processing technologies, Power semiconductor technologies and circuits
  • Advanced transistor and interconnect structures
  • Advanced Packaging, vertical (2.5D/3D) integration
  • Variation and fault-tolerant designs, Reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • RF, analog, mixed signal, and I/O circuits for future technology generations
  • Simulation and modeling of advanced processes, devices, and circuits
  • Design for manufacturing, yield, and test, System-on-Chip (SoC) and system-in-package (SiP) design integration
  • Emerging technologies, circuits and Applications (MEMS, memory, Internet of Thing, Autonomous cars, Machine Learning, Artificial Intelligence)